Welcome!

@CloudExpo Authors: Pat Romanski, Chris Colosimo, Carmen Gonzalez, Yeshim Deniz, Jason Bloomberg

News Feed Item

Intel Announces Intel® SSD DC S3700 Series -- Next-Generation Data Center Solid-State Drive (SSD)

As big data, high-performance computing (HPC) and cloud-computing applications push the demand for real-time access of data into the zettabytes, Intel Corporation announced today its next-generation data center solid-state drive (SSD), the Intel® Solid-State Drive DC S3700 Series, designed to remove storage bottlenecks and maximize multi-core CPU performance. The Intel SSD DC S3700 Series delivers fast, consistent performance and low latencies along with strong data protection and high endurance to help IT personnel support today’s most demanding data center applications.

Intel SSD DC S37000 Series -- The Intel SSD DC S3700 Series delivers fast, consistent performance an ...

Intel SSD DC S37000 Series -- The Intel SSD DC S3700 Series delivers fast, consistent performance and low latencies along with strong data protection and high endurance to help IT personnel support today's most demanding data center applications including big data, high-performance computing (HPC) and cloud applications. (Photo: Business Wire)

“Today’s data explosion creates unique storage challenges for data center professionals,” said Rob Crooke, Intel vice president and general manager for the Intel Non-Volatile Memory (NVM) Solutions Group. “High latencies and slow storage I/O can cripple data centers’ ability to deliver exciting big data or cloud-computing applications with fast, low latency data access. Intel’s next-generation Intel SSD DC S3700 Series breaks through SSD limitations for the data center on all fronts – fast, consistent performance, strong data protection and high endurance -- so IT professionals can deliver on their most demanding technology initiatives.”

The key to the Intel SSD DC S3700 Series superior and consistent fast performance is a tight distribution of Input/Outputs Per Second (IOPS) with low maximum latencies. The Intel SSD DC S3700 feeds I/O-starved applications with 4KB random read performance of up to 75,000 IOPS and 4KB write performance of up to 36,000 IOPS. With typical sequential write latency of 65 microseconds and high Quality of Service (QOS) of less than 500 microseconds 99.9 percent of the time, the Intel SSD DC S3700 ensures quick and consistent application response times.

This accelerated storage performance gives parallel multithreaded computing increased storage throughput to keep multicore CPUs more active. This reduces lapses in response time for end users for a smoother computing experience. For IT/data center professionals who must also worry about data protection and maximum security, the Intel SSD DC S3700 Series offers full end-to-end data protection and 256-bit Advanced Encryption Standard (AES) capability. To further improve reliability, the Intel SSD DC S3700 incorporates an array of surplus flash memory used for data redundancy to minimize potential data loss.

The drive incorporates Intel High Endurance Technology (HET) to deliver single-level cell SSD-like endurance in more cost-effective multi-level cell (MLC) technology. By combining SSD NAND management techniques with NAND silicon enhancements, HET enables the Intel SSD DC S37000 Series to achieve 10 full drive writes per day over the 5-year life of the drive. This is the equivalent of recording more than 186 years of HD video over the life of the highest capacity 800GB drive.

In addition, SSDs also improve overall power consumption. The Intel® SSD DC 3700 Series reduces typical active power consumption to 6 watts and idle 650 milliwatts, which reduces heat and therefore lowers both energy and cooling costs.

The Intel SSD DC S3700 Series is a 6 gigabit-per-second (Gbps) SATA drive with performance transfer rates of 500 megabyte per second (MB/s) reads and 460 MB/s writes. It delivers up to 2x read and 15x write performance over its previous generation Intel® SSD 710 Series. Samples of the product are now available for data center customers to begin quality and validation cycles. General production availability is expected to begin by the end of the year, with volume production in the first quarter of 2013.

The product comes in a 2.5-inch form factor for all capacities, 100, 200, 400 and 800 gigabytes (GB), and in a 1.8-inch form factor in 200GB and 400GB capacities. The recommended channel pricing (MSRP) for the 2.5-inch Intel SSD DC S3700 Series is as follows: $235 for 100 (GB) capacity; $470 for 200GB; $940 for 400GB and $1,880 for 800GB based on 1,000-unit quantities. The 1.8-inch drive MSRP pricing is $495 for the 200GB capacity and $965 for 400GB. Prices include a 5-year limited warranty.

For more information on Intel SSDs go to www.intel.com/go/ssd or follow Intel SSDs on Twitter (@intelssd), Facebook (www.intel.com/go/ssdfacebook or communities.intel.com).

About Intel

Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Note to editors: To download the multimedia press kit go to www.intel.com/newsroom/ssd. Intel will demonstrate the Intel SSD DC S3700 Series at the Super Computing (SC12) Conference, Booth #2601, Nov. 12-15 at the Salt Palace Convention Center in Salt Lake City.

Photos/Multimedia Gallery Available: http://www.businesswire.com/cgi-bin/mmg.cgi?eid=50464524&lang=en

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

@CloudExpo Stories
While some vendors scramble to create and sell you a fancy solution for monitoring your spanking new Amazon Lambdas, hear how you can do it on the cheap using just built-in Java APIs yourself. By exploiting a little-known fact that Lambdas aren’t exactly single threaded, you can effectively identify hot spots in your serverless code. In his session at 20th Cloud Expo, David Martin, Principal Product Owner at CA Technologies, will give a live demonstration and code walkthrough, showing how to o...
The explosion of new web/cloud/IoT-based applications and the data they generate are transforming our world right before our eyes. In this rush to adopt these new technologies, organizations are often ignoring fundamental questions concerning who owns the data and failing to ask for permission to conduct invasive surveillance of their customers. Organizations that are not transparent about how their systems gather data telemetry without offering shared data ownership risk product rejection, regu...
In his keynote at 19th Cloud Expo, Sheng Liang, co-founder and CEO of Rancher Labs, discussed the technological advances and new business opportunities created by the rapid adoption of containers. With the success of Amazon Web Services (AWS) and various open source technologies used to build private clouds, cloud computing has become an essential component of IT strategy. However, users continue to face challenges in implementing clouds, as older technologies evolve and newer ones like Docker c...
SYS-CON Events announced today that Hitachi, the leading provider the Internet of Things and Digital Transformation, will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Hitachi Data Systems, a wholly owned subsidiary of Hitachi, Ltd., offers an integrated portfolio of services and solutions that enable digital transformation through enhanced data management, governance, mobility and analytics. We help globa...
SYS-CON Events announced today that SoftLayer, an IBM Company, has been named “Gold Sponsor” of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2016, at the Javits Center in New York, New York. SoftLayer, an IBM Company, provides cloud infrastructure as a service from a growing number of data centers and network points of presence around the world. SoftLayer’s customers range from Web startups to global enterprises.
Cloud Expo, Inc. has announced today that Aruna Ravichandran, vice president of DevOps Product and Solutions Marketing at CA Technologies, has been named co-conference chair of DevOps at Cloud Expo 2017. The @DevOpsSummit at Cloud Expo New York will take place on June 6-8, 2017, at the Javits Center in New York City, New York, and @DevOpsSummit at Cloud Expo Silicon Valley will take place Oct. 31-Nov. 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA.
@DevOpsSummit at Cloud taking place June 6-8, 2017, at Javits Center, New York City, is co-located with the 20th International Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world. The widespread success of cloud computing is driving the DevOps revolution in enterprise IT. Now as never before, development teams must communicate and collaborate in a dynamic, 24/7/365 environment. There is no time to wait for long developm...
With major technology companies and startups seriously embracing IoT strategies, now is the perfect time to attend @ThingsExpo 2016 in New York. Learn what is going on, contribute to the discussions, and ensure that your enterprise is as "IoT-Ready" as it can be! Internet of @ThingsExpo, taking place June 6-8, 2017, at the Javits Center in New York City, New York, is co-located with 20th Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry p...
SYS-CON Events announced today that Juniper Networks (NYSE: JNPR), an industry leader in automated, scalable and secure networks, will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Juniper Networks challenges the status quo with products, solutions and services that transform the economics of networking. The company co-innovates with customers and partners to deliver automated, scalable and secure network...
SYS-CON Events announced today that Progress, a global leader in application development, has been named “Bronze Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Enterprises today are rapidly adopting the cloud, while continuing to retain business-critical/sensitive data inside the firewall. This is creating two separate data silos – one inside the firewall and the other outside the firewall. Cloud ISVs oft...
Five years ago development was seen as a dead-end career, now it’s anything but – with an explosion in mobile and IoT initiatives increasing the demand for skilled engineers. But apart from having a ready supply of great coders, what constitutes true ‘DevOps Royalty’? It’ll be the ability to craft resilient architectures, supportability, security everywhere across the software lifecycle. In his keynote at @DevOpsSummit at 20th Cloud Expo, Jeffrey Scheaffer, GM and SVP, Continuous Delivery Busine...
As pervasive as cloud technology is -- and as persuasive as the arguments are for using it -- the cloud has its limits. Some companies will always have security concerns about storing data in the cloud and certain high-transaction applications will always be better suited for on-premises storage. Those statements were among the bottom-line takeaways delivered at Cloud Expo this week, a three day, bi-annual event focused on cloud technologies, adoption and associated challenges.
Bert Loomis was a visionary. This general session will highlight how Bert Loomis and people like him inspire us to build great things with small inventions. In their general session at 19th Cloud Expo, Harold Hannon, Architect at IBM Bluemix, and Michael O'Neill, Strategic Business Development at Nvidia, discussed the accelerating pace of AI development and how IBM Cloud and NVIDIA are partnering to bring AI capabilities to "every day," on-demand. They also reviewed two "free infrastructure" pr...
SYS-CON Events announced today that T-Mobile will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. As America's Un-carrier, T-Mobile US, Inc., is redefining the way consumers and businesses buy wireless services through leading product and service innovation. The Company's advanced nationwide 4G LTE network delivers outstanding wireless experiences to 67.4 million customers who are unwilling to compromise on ...
SYS-CON Events announced today that Super Micro Computer, Inc., a global leader in compute, storage and networking technologies, will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Supermicro (NASDAQ: SMCI), the leading innovator in high-performance, high-efficiency server technology, is a premier provider of advanced server Building Block Solutions® for Data Center, Cloud Computing, Enterprise IT, Hadoop/...
NHK, Japan Broadcasting, will feature the upcoming @ThingsExpo Silicon Valley in a special 'Internet of Things' and smart technology documentary that will be filmed on the expo floor between November 3 to 5, 2015, in Santa Clara. NHK is the sole public TV network in Japan equivalent to the BBC in the UK and the largest in Asia with many award-winning science and technology programs. Japanese TV is producing a documentary about IoT and Smart technology and will be covering @ThingsExpo Silicon Val...
In his general session at 19th Cloud Expo, Manish Dixit, VP of Product and Engineering at Dice, discussed how Dice leverages data insights and tools to help both tech professionals and recruiters better understand how skills relate to each other and which skills are in high demand using interactive visualizations and salary indicator tools to maximize earning potential. Manish Dixit is VP of Product and Engineering at Dice. As the leader of the Product, Engineering and Data Sciences team at D...
The 20th International Cloud Expo has announced that its Call for Papers is open. Cloud Expo, to be held June 6-8, 2017, at the Javits Center in New York City, brings together Cloud Computing, Big Data, Internet of Things, DevOps, Containers, Microservices and WebRTC to one location. With cloud computing driving a higher percentage of enterprise IT budgets every year, it becomes increasingly important to plant your flag in this fast-expanding business opportunity. Submit your speaking proposal ...
Keeping pace with advancements in software delivery processes and tooling is taxing even for the most proficient organizations. Point tools, platforms, open source and the increasing adoption of private and public cloud services requires strong engineering rigor – all in the face of developer demands to use the tools of choice. As Agile has settled in as a mainstream practice, now DevOps has emerged as the next wave to improve software delivery speed and output. To make DevOps work, organization...
SYS-CON Events announced today that CollabNet, a global leader in enterprise software development, release automation and DevOps solutions, will be a Bronze Sponsor of SYS-CON's 20th International Cloud Expo®, taking place from June 6-8, 2017, at the Javits Center in New York City, NY. CollabNet offers a broad range of solutions with the mission of helping modern organizations deliver quality software at speed. The company’s latest innovation, the DevOps Lifecycle Manager (DLM), supports Value S...