SYS-CON Events announced today that nfina Technologies, a provider of highly reliable cloud server products, will exhibit at SYS-CON's 12th International Cloud Expo, which will take place on June 10–13, 2013, at the Javits Center in New York City, New York.
nfina Technologies develops, manufactures, and markets highly reliable cloud server products, designed to solve the most demanding data center requirements in mission-critical cloud applications. Nfina’s staff has decades of experience in co...| By PR Newswire | Article Rating: |
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| December 27, 2012 08:00 AM EST | Reads: |
541 |
DALLAS, Dec. 27, 2012 /PRNewswire/ -- Texas Instruments Incorporated (TI) (NASDAQ: TXN) today announced it is collaborating with SoftKinetic®, a leading provider of end-to-end 3D sensor and gesture recognition middleware solutions, to grow adoption of gesture control in televisions (TVs), personal computers (PCs), and a wide variety of other consumer and industrial devices. At the 2013 Consumer Electronics Show (CES), TI will demonstrate its new 3D time-of-flight (ToF) image sensor chipset, which integrates SoftKinetic's DepthSense® pixel technology and runs SoftKinetic's iisu® middleware for finger, hand and full-body tracking. The TI chipset is inside 3D cameras that control a laptop and a smart TV to access and navigate movies, games and other content with the wave of a hand. The TV demonstration also features TI's OMAP™ 5 processor, which powers an impressive natural user interface with robust gesture recognition and full-HD graphics.
Both demonstrations will be showcased at CES 2013 in the TI Village, North Hall of the Las Vegas Convention Center. "SoftKinetic has long believed that motion control and gesture recognition is the future of user interfaces and digital interactivity," said Michel Tombroff, chief executive officer of SoftKinetic. "We are pleased to collaborate with TI to help bring this technology into the mass market, and look forward to having our technology impact the everyday lives of consumers."
Current 3D gesture recognition solutions lack real-time tracking and suffer from poor sensitivity, which can cause sluggish performance. TI's ToF chipset, featuring a 3D sensor employing SoftKinetic's DepthSense pixel technology, overcomes this problem to deliver high sensitivity and the real-time motion tracking responsiveness consumers expect. The TI and SoftKinetic solution enables precise tracking of finger, hand and full-body gestures. TI plans to follow its initial products with a complete portfolio of solutions suitable for various applications and form factors. For more information and to see a laptop demonstration video, visit www.ti.com/3dtof-pr.
"There are a plethora of applications that can benefit from the accuracy and resolution of this technology," said Gaurang Shah, vice president of Audio and Imaging Products at TI. "Imagine an end equipment designer tilting, rotating, compressing and expanding a new product in 3D to inspect and evaluate it on their PC before committing to a hardware prototype. We believe our collaboration with SoftKinetic will ignite more applications like this, and foster further technology innovation to simplify the way we interact with machines."
Not attending CES? Stay connected with TI:
- TI's CES activities
- TI on Twitter
- TI on Facebook
- TI on Google +
About Innovation at TI
For more than 80 years, TI has been at the forefront of technical innovation, enabling customers to differentiate products with higher integration, faster speeds and lower power. Today, we are engineering the future with advances in energy harvesting, power management, cloud computing, safety and security, health technology, and more. Learn more about how TI's Analog and Embedded Processing products are improving how we live, work and play, today and well into the future, at www.ti.com/innovation.
About Texas Instruments
Texas Instruments semiconductor innovations help 90,000 customers unlock the possibilities of the world as it could be – smarter, safer, greener, healthier and more fun. Our commitment to building a better future is ingrained in everything we do – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities. This is just the beginning of our story. Learn more at http://www.ti.com.
Trademarks
OMAP is a trademark of Texas Instruments. All other trademarks and registered trademarks belong to their respective owners.
SOURCE Texas Instruments Incorporated (TI)
Published December 27, 2012 Reads 541
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SYS-CON Events announced today that nfina Technologies, a provider of highly reliable cloud server products, will exhibit at SYS-CON's 12th International Cloud Expo, which will take place on June 10–13, 2013, at the Javits Center in New York City, New York.
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SYS-CON Events announced today that OpenStack will exhibit at SYS-CON's 12th International Cloud Expo, which will take place on June 10–13, 2013, at the Javits Center in New York City, New York. OpenStack software controls large pools of compute, storage, and networking resources throughout a datacenter, all managed by a dashboard that gives administrators control while empowering their users to provision resources through a web interface.
OpenStack powers some of the most widely-used SaaS app...
“Social, mobile, analytics and cloud can’t be looked at as distinct technology trends; they are facets of the same movement and an everyday reality for consumers and businesses alike,” said Craig Sowell, IBM VP of SmartCloud Marketing, in this exclusive Q&A with Cloud Expo Conference Chair Jeremy Geelan. “This means that businesses need to start looking at trends as one: cloud is the delivery, analytics is the unique insight, social is a shareable service, and mobile is the ubiquitous access.”
...
With Cloud Expo New York | 12th Cloud Expo [June 10-13, 2013] hurtling towards us, let's take a look at the distinguished individuals in our incredible Speaker Faculty for the technical and strategy sessions at the conference coming up June 10-13 at the Jacob Javits Center in New York City.
We have technical and strategy sessions for you all four days dealing with every nook and cranny of Cloud Computing and Big Data, but what of those who are presenting? Who are they, where do they work, wha...
The new open source cloud orchestration platform called OpenStack is the promise of flexible network virtualization, and network overlays are looking closer than ever. The vision of this platform is to enable the on-demand creation of many distinct networks on top of one underlying physical infrastructure in the cloud environment. The platform will support automated provisioning and management of large groups of virtual machines or compute resources, including extensive monitoring in the cloud.
In his session at the 12th International Cloud Expo, Dave Eichorn, Global Data Center Practice Head at Zensar, will share a case study describing how a utility services company handled the migration of its Microsoft platform to the cloud. Challenged with the time-consuming task of opening operations out of temporary offices, this company struggled with the need to simultaneously access data that was accumulated from a vast amount of data-intensive jobs. Zensar migrated the company’s application ...
At pennies per virtual machine-hour, the economics of cloud computing are both compelling and daunting to replicate. Whether you are building your own cloud infrastructure, building a public cloud or choosing a cloud service, there are key strategy and technology decisions that make the difference between success and failure.
In his General Session at the 12th International Cloud Expo, Jason Waxman, VP in the Intel Architecture Group and general manager of the Cloud Platforms Group within Inte...
You're getting pitched every day from your legacy enterprise software and hardware vendors about "cloud." They're doing an amazing job of convincing your CIO and CTO about what cloud is and how you should use it. The reality is they're defending their shrinking market share and keeping you on the legacy treadmill for as long as they can by selling you solutions that aren't "cloud."
In her session at the 12th International Cloud Expo, Niki Acosta, Cloud Evangelista for Rackspace, will talk thro...
The rise of cloud computing has exposed hard drive-based storage as the new data center bottleneck. Combating this, data center managers have deployed SSDs to gain the performance needed to provide real-time access to data. However, due to budget constraints, many have turned to consumer-grade SSDs without understanding that they wear out quickly when processing enterprise workloads. In this session, Esther Spanjer will discuss recent endurance advancements in SSD technology that enable usage of...
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